UAH Archives, Special Collections, and Digital Initiatives

Browse Items (8023 total)

  • ManuplanSatV.pdf

    This procedure provides the necessary information for the fabrication and assembly of the Saturn C-5 booster stage S-IC. The manufacturing methods outlined herein represent techniques that will be utilized both at Michoud and MSFC wherever possible. The concepts and methods outlined are of a preliminary nature consistent with the stage of design at this time. These concepts and methods are subject to change. This Manufacturing Plan will be periodically updated to reflect such changes. The processes and techniques proposed in this Manufacturing Plan are generally within the present state of the art, consistent with reliability requirements for manned space flight and advocated for use with the limited manufacturing facilities of the Marshall Space Flight Center and the Michoud Production Facility.; Includes memorandum dated 15 Jan. 1963 from J. H. Chesteen, Chief, Engineering Planning Section. M-ME-SE.; Includes memorandum from J. H. Chesteen and N. E. Johansen to W. B. Edmiston and W. R. Kuers--subject: Integration Boeing-MSFC Manufacturing plan. December 18, 1962.
  • ManuplanSatV(1).pdf

    Manufacturing plan for Saturn V Booster stage S-IC
  • Manuplanfor16-25.pdf

    Manufacturing plan for for SII stages 16 through 25.
  • mannspacfligv3bk3.pdf

    OMSF Program Status Review October 1965.; Edition "A".
  • MannspacfligIII.pdf

    OMSF program status review October 1965.; Edition "A".
  • Monprog.pdf
  • Michandmiss.pdf

    This document contains copies of management charts and photographs maintained in the Management Information Office of the Executive Staff on Michoud and Mississippi Test Operations. Information on other MSFC activities and facilities will be published in separate volumes as indicated on the following page. Most of these charges are included in Dr. von Braun's, Dr. Rees' and Mr. Gorman's Management Information Consoles.
  • Meticulousengineering_022808145534.pdf

    The need for high reliability and great care in modern engineering is stressed. Disciplines to eliminate or decrease errors are described. College courses should interweave this approach into study projects.
  • Methcleaeleccomp_022008153249.pdf

    In describing the cleaning of electronic components and subassemblies, it must be taken into consideration that each part to be cleaned presents an individual problem. The method of cleaning must be tailored to the type of part to be cleaned as well as to the type of soil to be removed. This paper reviews some of the methods used in cleaning electronic arts, particularly printed circuits, as well as other critical hardware which is used in support of electronic assemblies. Some of the methods covered include the use of abrasives, acids, solvents and alkalies, and the employment of these in combination with ultrasonic and other automatic systems. The clean room in use at IBM Huntsville is described briefly, along with the solutions and solvents used in cleaning electronic and supporting parts. Cleanliness- requirements for the area and the materials, together with procedures for meeting them give added emphasis to the critical nature of today's contamination control programs. The paper concludes with a summary of the cleaning procedures and the cleanroom benefits to be obtained by using present day technologies to improve them.
  • Nasamanaprog_011509091310.pdf

    Address by Dr. George E. Mueller, Associate Administrator for Manned Space Flight, National Aeronautics and Space Administration; Joint AIAA/CASI Meeting, Montreal, Canada, July 8, 1968. AS DELIVERED.; Includes charts.